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FI-R Series Connectors for High Speed Board to Cable Digital Signal Transmission

JAE Releases FI-R Series High Speed Board to Cable Connectors for LVDS, TMDS (HDMI), and PCI Express Signals

June 21, 2010

JAE recently announced the development of their FI-R series board to cable interconnection solution for High Speed Digital serial transmission LVDS, TMDS (HDMI) and PCI Express signals.

JAE's FI-R series board to cable connectors were developed to target the following applications: TV, Personal Computer, Medical devices, Copiers, Consumer devices.  Below listed are some of the features and general specifications associated with the FI-R series.  

 

 

Features

General Specifications

  • Number of positions: 21,31,41,51
  • Contact Pitch: 0.5mm, 0.8 Amps max/contact (receptacle) 0.7 Amps, max/contact (plug)
  • Dielectric withstanding voltage: 500 VAC r.m.s. (1 minute)
  • Insulation resistance: 100 megohms min.
  • Contact Resistance 40 milliohms max.
  • Applicable wire: Crimp Discrete wire 30,32,36 AWG,  Solder Coaxial wire 40 AWG
  • Operating Temperature: -40 ~ 85 deg. C

 

To sample, quote, buy, or for more information regarding JAE's FI-R series high speed digital serial transmission board to cable connectors or any other JAE connector, please contact Edge Electronics, your JAE distributor.

 

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