Authorized distribution · Established 1990 · ISO 9001:2015 Bohemia, New York · 800.647.3343

Everspin

Everspin MR25H40 MRAM

4 Mb Toggle MRAM with SPI for data that must survive loss of power.

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Family specifications

MR25H40 ordering options

Density / capacity
4 Mb
Interface / type
SPI
I/O width
SPI
Supply voltage
3.3 V
Package
DFN-8 Small Flag
Operating temperature
-40 to +85 °C, -40 to +125 °C, -40 to +105 °C
Clock frequency
40 MHz

Options vary by complete part number. Match the selected device to the controller, board layout and operating conditions.

Available MR25H40 part numbers.

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Interface
Density
Supply voltage
Package
Operating temperature
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5 products
MR25H40CDFEverspin MR25H404 Mb Toggle MRAM with SPI, SPI I/O, DFN-8 Small Flag package, and -40 to +85 °C operation. 4 MbSPI3.3 VDFN-8 Small Flag−40 to 85 °C40 MHzSPIMass production (MP)Toggle MRAMMR25H40
MR25H40CDFREverspin MR25H404 Mb Toggle MRAM with SPI, SPI I/O, DFN-8 Small Flag package, and -40 to +85 °C operation. 4 MbSPI3.3 VDFN-8 Small Flag−40 to 85 °C40 MHzSPIMass production (MP)Toggle MRAMMR25H40
MR25H40MDFREverspin MR25H404 Mb Toggle MRAM with SPI, SPI I/O, DFN-8 Small Flag package, and -40 to +125 °C operation. 4 MbSPI3.3 VDFN-8 Small Flag−40 to 125 °C40 MHzSPIMass production (MP)Toggle MRAMMR25H40
MR25H40VDFEverspin MR25H404 Mb Toggle MRAM with SPI, SPI I/O, DFN-8 Small Flag package, and -40 to +105 °C operation. 4 MbSPI3.3 VDFN-8 Small Flag−40 to 105 °C40 MHzSPIMass production (MP)Toggle MRAMMR25H40
MR25H40VDFREverspin MR25H404 Mb Toggle MRAM with SPI, SPI I/O, DFN-8 Small Flag package, and -40 to +105 °C operation. 4 MbSPI3.3 VDFN-8 Small Flag−40 to 105 °C40 MHzSPIMass production (MP)Toggle MRAMMR25H40

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Design considerations

SPI devices use a small pin count for frequent writes without a flash erase cycle. MR10Q010 provides a 1 Mb Quad SPI option with separate 3.3 V core and 1.8 V I/O supplies. Check the command set and power sequencing when replacing another serial memory.

Documents

PDF
MR25H40 family datasheet

Electrical characteristics, timing, package drawings and ordering information.

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