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Micron

PCIe Gen6 data center SSD

Micron 9650 NVMe SSD

The Micron 9650 is Micron's PCIe Gen6 NVMe data center SSD. Compare the E3.S PRO and MAX configurations below, from 3.2TB to 30.72TB, and work with Edge to confirm supply and the exact specifications your platform requires.

28 GB/s Maximum sequential read
5.5M Maximum random read IOPS
3.2–30.72TB Available capacities
See part numbers

Edge Electronics is an authorized Micron distributor. Comparing generations? Read our PCIe Gen6 design-readiness guide →

Micron 9650 NVMe SSD

At a glance

Micron 9650 at a glance. Confirm against the current datasheet before you qualify.

Interface
PCIe Gen6 x4, NVMe; confirm protocol revision and host support for the selected part
NAND
Micron G9 TLC
Models
9650 PRO (read-intensive, 1 DWPD) · 9650 MAX (mixed-use, 3 DWPD)
Capacities
PRO: 3.84TB to 30.72TB · MAX: 3.2TB to 25.6TB
Form factors
E3.S 1T (7.5mm), E1.S (9.5mm, liquid-cooling optimized)
Sequential read / write
Up to 28,000 / 14,000 MB/s
Random read
Up to 5.5M IOPS
Security
SED and non-SED configurations; confirm exact security protocols and qualification
Compliance
FIPS 140-3 Level 2 certifiable on SED models (per Micron); TAA-compliant sourcing on request
Warranty
5 years (Micron)

Choose the 9650 PRO for read-intensive workloads or the 9650 MAX for mixed-use applications. Options include E3.S and liquid-cooling-optimized E1.S form factors and self-encrypting (SED) configurations. Micron lists FIPS 140-3 Level 2 as certifiable on the SED models; TAA-compliant sourcing is on request.

Part numbers

Choose from the E3.S configurations below. Contact Edge to confirm availability and application fit. Exact NVMe and security protocol versions, sector formats and any FIPS or TAA requirement need confirmation for the selected part.

Micron 9650 E3.S part numbers by capacity, model and security option
Capacity Model Form factor Non-SEDSED
3.84TB PRO E3.S 1T (7.5 mm) MTFDMBQ3T8THM-2BP1JABYY MTFDMBQ3T8THM-2BP1DFCYY
7.68TB PRO E3.S 1T (7.5 mm) MTFDMBQ7T6THM-2BP1JABYY MTFDMBQ7T6THM-2BP1DFCYY
15.36TB PRO E3.S 1T (7.5 mm) MTFDMBQ15T3THM-2BP1JABYY MTFDMBQ15T3THM-2BP1DFCYY
30.72TB PRO E3.S 1T (7.5 mm) MTFDMBQ30T7THM-2BP1JABYY MTFDMBQ30T7THM-2BP1DFCYY
3.2TB MAX E3.S 1T (7.5 mm) MTFDMBQ3T2THP-2BP1JABYY MTFDMBQ3T2THP-2BP1DFCYY
6.4TB MAX E3.S 1T (7.5 mm) MTFDMBQ6T4THP-2BP1JABYY MTFDMBQ6T4THP-2BP1DFCYY
12.8TB MAX E3.S 1T (7.5 mm) MTFDMBQ12T8THP-2BP1JABYY MTFDMBQ12T8THP-2BP1DFCYY
25.6TB MAX E3.S 1T (7.5 mm) MTFDMBQ25T6THP-2BP1JABYY MTFDMBQ25T6THP-2BP1DFCYY
These exact part numbers replace the older examples in the family brief. SED identifies the security variant; it does not establish a particular Opal revision or FIPS certification. Contact Edge for current documentation and sourcing.

Available 9650 part numbers.

Filter by what the design needs, or search within the results.

Interface
PCIe Gen6 x4, NVMe
NAND type
TLC
Operating temperature
0 to 70 °C
Form factor
E3.S 1T (7.5 mm)
Add / remove columnsChoose details
16 products
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MTFDMBQ3T2THP-2BP1DFCYYMicron · 9650 MAXMicron 9650 MAX, 3200GB, E3.S 1T (7.5 mm), PCIe Gen6 x4, NVMe, SED. Contact Edge to confirm availability, host compatibility and exact security requirements. 3.2 TB3 DWPDSEDE3.S 1T (7.5 mm)PCIe Gen6 x4, NVMeTLC0 to 70 °C
MTFDMBQ3T2THP-2BP1JABYYMicron · 9650 MAXMicron 9650 MAX, 3200GB, E3.S 1T (7.5 mm), PCIe Gen6 x4, NVMe, Non-SED. Contact Edge to confirm availability, host compatibility and exact security requirements. 3.2 TB3 DWPDNon-SEDE3.S 1T (7.5 mm)PCIe Gen6 x4, NVMeTLC0 to 70 °C
MTFDMBQ3T8THM-2BP1DFCYYMicron · 9650 PROMicron 9650 PRO, 3840GB, E3.S 1T (7.5 mm), PCIe Gen6 x4, NVMe, SED. Contact Edge to confirm availability, host compatibility and exact security requirements. 3.84 TB1 DWPDSEDE3.S 1T (7.5 mm)PCIe Gen6 x4, NVMeTLC0 to 70 °C
MTFDMBQ3T8THM-2BP1JABYYMicron · 9650 PROMicron 9650 PRO, 3840GB, E3.S 1T (7.5 mm), PCIe Gen6 x4, NVMe, Non-SED. Contact Edge to confirm availability, host compatibility and exact security requirements. 3.84 TB1 DWPDNon-SEDE3.S 1T (7.5 mm)PCIe Gen6 x4, NVMeTLC0 to 70 °C
MTFDMBQ6T4THP-2BP1DFCYYMicron · 9650 MAXMicron 9650 MAX, 6400GB, E3.S 1T (7.5 mm), PCIe Gen6 x4, NVMe, SED. Contact Edge to confirm availability, host compatibility and exact security requirements. 6.4 TB3 DWPDSEDE3.S 1T (7.5 mm)PCIe Gen6 x4, NVMeTLC0 to 70 °C
MTFDMBQ6T4THP-2BP1JABYYMicron · 9650 MAXMicron 9650 MAX, 6400GB, E3.S 1T (7.5 mm), PCIe Gen6 x4, NVMe, Non-SED. Contact Edge to confirm availability, host compatibility and exact security requirements. 6.4 TB3 DWPDNon-SEDE3.S 1T (7.5 mm)PCIe Gen6 x4, NVMeTLC0 to 70 °C
MTFDMBQ7T6THM-2BP1DFCYYMicron · 9650 PROMicron 9650 PRO, 7680GB, E3.S 1T (7.5 mm), PCIe Gen6 x4, NVMe, SED. Contact Edge to confirm availability, host compatibility and exact security requirements. 7.68 TB1 DWPDSEDE3.S 1T (7.5 mm)PCIe Gen6 x4, NVMeTLC0 to 70 °C
MTFDMBQ7T6THM-2BP1JABYYMicron · 9650 PROMicron 9650 PRO, 7680GB, E3.S 1T (7.5 mm), PCIe Gen6 x4, NVMe, Non-SED. Contact Edge to confirm availability, host compatibility and exact security requirements. 7.68 TB1 DWPDNon-SEDE3.S 1T (7.5 mm)PCIe Gen6 x4, NVMeTLC0 to 70 °C
MTFDMBQ12T8THP-2BP1DFCYYMicron · 9650 MAXMicron 9650 MAX, 12800GB, E3.S 1T (7.5 mm), PCIe Gen6 x4, NVMe, SED. Contact Edge to confirm availability, host compatibility and exact security requirements. 12.8 TB3 DWPDSEDE3.S 1T (7.5 mm)PCIe Gen6 x4, NVMeTLC0 to 70 °C
MTFDMBQ12T8THP-2BP1JABYYMicron · 9650 MAXMicron 9650 MAX, 12800GB, E3.S 1T (7.5 mm), PCIe Gen6 x4, NVMe, Non-SED. Contact Edge to confirm availability, host compatibility and exact security requirements. 12.8 TB3 DWPDNon-SEDE3.S 1T (7.5 mm)PCIe Gen6 x4, NVMeTLC0 to 70 °C
MTFDMBQ15T3THM-2BP1DFCYYMicron · 9650 PROMicron 9650 PRO, 15360GB, E3.S 1T (7.5 mm), PCIe Gen6 x4, NVMe, SED. Contact Edge to confirm availability, host compatibility and exact security requirements. 15.36 TB1 DWPDSEDE3.S 1T (7.5 mm)PCIe Gen6 x4, NVMeTLC0 to 70 °C
MTFDMBQ15T3THM-2BP1JABYYMicron · 9650 PROMicron 9650 PRO, 15360GB, E3.S 1T (7.5 mm), PCIe Gen6 x4, NVMe, Non-SED. Contact Edge to confirm availability, host compatibility and exact security requirements. 15.36 TB1 DWPDNon-SEDE3.S 1T (7.5 mm)PCIe Gen6 x4, NVMeTLC0 to 70 °C
MTFDMBQ25T6THP-2BP1DFCYYMicron · 9650 MAXMicron 9650 MAX, 25600GB, E3.S 1T (7.5 mm), PCIe Gen6 x4, NVMe, SED. Contact Edge to confirm availability, host compatibility and exact security requirements. 25.6 TB3 DWPDSEDE3.S 1T (7.5 mm)PCIe Gen6 x4, NVMeTLC0 to 70 °C
MTFDMBQ25T6THP-2BP1JABYYMicron · 9650 MAXMicron 9650 MAX, 25600GB, E3.S 1T (7.5 mm), PCIe Gen6 x4, NVMe, Non-SED. Contact Edge to confirm availability, host compatibility and exact security requirements. 25.6 TB3 DWPDNon-SEDE3.S 1T (7.5 mm)PCIe Gen6 x4, NVMeTLC0 to 70 °C
MTFDMBQ30T7THM-2BP1DFCYYMicron · 9650 PROMicron 9650 PRO, 30720GB, E3.S 1T (7.5 mm), PCIe Gen6 x4, NVMe, SED. Contact Edge to confirm availability, host compatibility and exact security requirements. 30.72 TB1 DWPDSEDE3.S 1T (7.5 mm)PCIe Gen6 x4, NVMeTLC0 to 70 °C
MTFDMBQ30T7THM-2BP1JABYYMicron · 9650 PROMicron 9650 PRO, 30720GB, E3.S 1T (7.5 mm), PCIe Gen6 x4, NVMe, Non-SED. Contact Edge to confirm availability, host compatibility and exact security requirements. 30.72 TB1 DWPDNon-SEDE3.S 1T (7.5 mm)PCIe Gen6 x4, NVMeTLC0 to 70 °C

Filter products

Capacity
Endurance (DWPD)
Security

Family brief capacities and form factors

The public family brief describes two workload-focused models: the read-intensive 9650 PRO (1 drive write per day) and the mixed-use 9650 MAX (3 drive writes per day). Every capacity is offered in E3.S 1T. The liquid-cooling-optimized E1.S 9.5mm is offered with select PRO capacities. We can help you find the option that fits your system.

Micron 9650 capacities, endurance classes, and form factors
Rated capacity Model / endurance E3.S 1T (7.5mm)E1.S (9.5mm, liquid-cooling optimized)
7.68TB PRO · 1 DWPD Available Available
15.36TB PRO · 1 DWPD Available Available
30.72TB PRO · 1 DWPD Available Not offered
6.4TB MAX · 3 DWPD Available Not offered
12.8TB MAX · 3 DWPD Available Not offered
25.6TB MAX · 3 DWPD Available Not offered
Micron lists liquid-cooling support for the E1.S 9.5mm form factor. The current E3.S part table also includes 3.84TB PRO and 3.2TB MAX configurations. Confirm exact specifications with Edge; family maximums are not per-part guarantees.

PRO or MAX? Pick by workload

9650 PRO

1 DWPD

Read-intensive · 7.68TB / 15.36TB / 30.72TB

Random read / write
Up to 5.5M / 570K IOPS
Endurance (30.72TB)
56,064 TBW (random)
Best for
AI inference serving, model repositories, content delivery, read-heavy databases, data-lake acceleration

9650 MAX

3 DWPD

Mixed-use · 6.4TB / 12.8TB / 25.6TB

Random read / write
Up to 5.5M / 900K IOPS
Endurance (25.6TB)
140,160 TBW (random)
Best for
AI training scratch space, checkpointing, caching layers, logging, write-intensive OLTP

Which form factor fits?

E3.S 1T

76 x 113 x 7.5mm

Capacities
6.4TB to 30.72TB
Cooling
Air-cooled; standard EDSFF bays
Best for
Mainstream Gen6-ready servers and full-capacity PRO and MAX deployments

E1.S

Liquid-cooling optimized

9.5mm EDSFF

Capacities
7.68TB to 15.36TB (PRO)
Cooling
Designed for cold-plate liquid cooling; air also supported
Best for
Dense liquid-cooled AI sleds and GPU server storage

Gen5 vs Gen6: the difference in numbers

The Micron 9650 (PCIe Gen6) against Micron's prior-generation Gen5 flagship, using Micron's published maximums for each drive.

Micron 9650 · Gen6 Prior generation · Gen5 (Micron 9550)

Sequential read (MB/s) 2x
28,000
14,000
Sequential write (MB/s) +40%
14,000
10,000
Random read (thousand IOPS) +67%
5,500
3,300
Read efficiency (MB/s per watt) 2x
1,120
560

Translate it: how long does the transfer take?

1.4 s Micron 9650 · Gen6
2.9 s Prior generation · Gen5 (Micron 9550)

Theoretical single-drive transfer time at maximum sequential bandwidth (reads 28 vs 14 GB/s, writes 14 vs 10 GB/s). Real-world results vary by platform and workload. Full Gen6 bandwidth requires a compatible PCIe Gen6 host. Micron's efficiency comparison uses a 25W power state.

Key benefits, per Micron

  • Up to 28,000 MB/s sequential read (2x Gen5), 14,000 MB/s sequential write, and 5.5M random read IOPS to keep GPUs fed
  • Energy efficiency for AI at scale: 1,120 MB/s per watt on reads (2x the prior generation) and up to 220 KIOPS per watt, based on Micron's comparison at a 25W power state
  • Liquid-cooling-ready E1.S design with roughly 90% of heat-generating components on a single PCB side, for direct cold-plate contact and sustained Gen6 speeds without throttling
  • Vertically integrated Micron design with G9 TLC NAND, DRAM, controller ASIC, and firmware, validated with a Gen6 ecosystem including AMD, NVIDIA, Dell, Astera Labs, and Marvell
  • Security built in: SPDM 1.2 attestation, Micron Secure Execution Environment, SED options, and FIPS 140-3 Level 2 certifiable configurations

Built for the cooling loop

Micron uses an 8-GPU server example to illustrate the move from an 8U air-cooled design to a dense 2U liquid-cooled sled. The 9650's E1.S 9.5mm variant was thermally designed from the ground up for cold-plate liquid cooling. Roughly 90% of its heat-generating components sit on a single PCB side for direct, uniform cold-plate contact. Compatible system implementations can use spring-loaded cold plates and quick-disconnect manifolds while preserving hot-swap serviceability.

Micron modeled a 32-drive server at 25W per SSD. In that scenario, moving SSD heat required roughly 38–81W of fan power with air cooling versus 0.4–1.4W of pump power with liquid cooling, a roughly 98% reduction. Actual savings depend on server design and operating conditions. Air-cooled options remain available in both form factors.

Security and compliance

The 9650 is offered with self-encrypting drive (SED, TCG Opal 2.01) options, and Micron lists FIPS 140-3 Level 2 as certifiable on those models. It also includes SPDM 1.2 device attestation, digitally signed firmware, and Micron's Secure Execution Environment, an electrically isolated security processor inside the controller. For defense and government programs, TAA-compliant sourcing is on request; we confirm compliance for the exact part number before quoting.

Key specifications

Micron 9650 key technical specifications

Interface
PCIe Gen6 x4, NVMe; confirm protocol revision and host support for the selected part
NAND
Micron G9 TLC, six-plane architecture, 3.6 GB/s NAND I/O
Models
9650 PRO (read-intensive, 1 DWPD) · 9650 MAX (mixed-use, 3 DWPD)
Capacities
PRO: 3.84TB to 30.72TB · MAX: 3.2TB to 25.6TB
Form factors
E3.S 1T (7.5mm), E1.S (9.5mm, liquid-cooling optimized)
Sequential read
Up to 28,000 MB/s
Sequential write
Up to 14,000 MB/s
Random read
Up to 5,500,000 IOPS
Random write
Up to 900,000 IOPS (MAX)
Latency (typical)
60 µs read / 15 µs write
Power
Up to 18W sequential read, up to 16W sequential write (average RMS)
Efficiency
1,120 MB/s per watt (read, 2x Gen5) · 220 KIOPS per watt (random read)
MTTF
2.0M hours at 0–55°C · 2.5M hours at 0–50°C
UBER
Less than 1 sector per 10¹⁷ bits read
Security
SPDM 1.2, SED (TCG Opal 2.01) options, Micron SEE, digitally signed firmware
Compliance
FIPS 140-3 Level 2 certifiable (SED models) · OCP 2.6 · TAA-compliant sourcing on request
Warranty
5 years

Values are for reference only and are not warrantied. Performance was measured at steady state per SNIA Enterprise v1.1 methodology; see the Micron 9650 product brief for full test conditions. Full Gen6 bandwidth requires a compatible PCIe Gen6 host. The 1,120 MB/s per watt efficiency figure uses Micron's 25W comparison methodology, while the 18W read and 16W write figures are sequential average RMS values.

Performance by model and capacity

The manufacturer family brief lists the maximums below. Confirm performance for the exact part you select; family maximums do not establish performance for each newer ordering number.

Micron 9650 performance and endurance by model and capacity
CapacityModelRandom read (KIOPS)Random write (KIOPS)Endurance (TBW, random)
7.68TBPRO5,40050014,016
15.36TBPRO5,50053028,032
30.72TBPRO5,50057056,064
6.4TBMAX5,40090035,040
12.8TBMAX5,50090070,080
25.6TBMAX5,500900140,160
The family brief lists typical latency of 60 µs read / 15 µs write. Sequential endurance ratings are higher; see the product brief for TBW under sequential workloads.

Lifecycle status changes. Confirm current status and the roadmap with us before you qualify.

Availability and platform support

The 9650 entered mass production in February 2026, per Micron, as the first PCIe Gen6 enterprise SSD to reach that milestone. Micron is working with OEM and AI data center customers to qualify the drive across the Gen6 ecosystem. The drive can negotiate to an earlier PCIe generation on a compatible platform, but performance and support still depend on the server, firmware, slot, and system validation. We can help with product configurations, sample coordination through Micron, and platform qualification questions.

What we add

As an authorized Micron distributor, we help with:

  • Matching the model, capacity, form factor, and cooling approach to your workload, with our technical team and, when needed, Micron's
  • DPAS-rated orders, TAA-compliant sourcing on request confirmed at the part-number level, and documentation such as Statements of Volatility
  • Current pricing and availability, and sample coordination through Micron for early qualification

Frequently asked questions

What is the Micron 9650 NVMe SSD?

The Micron 9650 is Micron's PCIe Gen6 data center SSD, which Micron describes as the first of its kind, with up to 28,000 MB/s sequential reads and 5.5M random read IOPS. It's built on Micron G9 TLC NAND for AI and performance-critical data center workloads, in PRO (1 DWPD) and MAX (3 DWPD) models from 6.4TB to 30.72TB.

Will the 9650 work in my current PCIe Gen5 servers?

Possibly. The PCIe link can run at an older generation, but compatibility also depends on the E1.S or E3.S slot, power, firmware, BIOS, thermals, and OEM validation. Send us your server model and configuration and we can help check. Full 28 GB/s performance requires a compatible PCIe Gen6 host.

What is the difference between the 9650 PRO and 9650 MAX?

Both share the Gen6 interface and up to 28,000 MB/s reads. The 9650 PRO (7.68TB to 30.72TB) is read-intensive at 1 drive write per day, suited to inference serving and read-heavy workloads. The 9650 MAX (6.4TB to 25.6TB) is mixed-use at 3 drive writes per day with up to 900K random write IOPS for training scratch, checkpointing, caching, and logging.

Does the 9650 require liquid cooling?

No. Air-cooled options are fully supported. The E1.S 9.5mm variant is thermally designed for cold-plate liquid cooling, with roughly 90% of heat-generating components on a single PCB side. In Micron's modeled 32-drive scenario, moving SSD heat required roughly 98% less cooling power with liquid than with air. Actual system results will vary.

Does the selected configuration meet our FIPS requirement?

Tell us the validation your program requires. We’ll request the available manufacturer documentation for the exact configuration. FIPS-certifiable does not establish that validation has been completed.

Can you help with TAA-compliant sourcing?

TAA-compliant sourcing is available on request, subject to product eligibility, availability, and confirmed country of origin.

What is the part number for the 30TB Micron 9650?

The 30.72TB 9650 PRO E3.S configurations are MTFDMBQ30T7THM-2BP1JABYY (non-SED) and MTFDMBQ30T7THM-2BP1DFCYY (SED). Contact Edge to confirm availability and exact security, sector-format and host requirements.

Can I buy the Micron 9650 from Edge Electronics?

Yes. Edge Electronics is an authorized Micron distributor. Request pricing and availability, and our technical team can help match the model, capacity, and cooling approach to your workload.

Documents

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